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Veshay Akemond TSK Series PCB Strain Measuring Instrument Dynamic Force Testing

  •  Veshay Akemond TSK Series PCB Strain Measuring Instrument Dynamic Force Testing
  •  Veshay Akemond TSK Series PCB Strain Measuring Instrument Dynamic Force Testing
  •  Veshay Akemond TSK Series PCB Strain Measuring Instrument Dynamic Force Testing
  •  Veshay Akemond TSK Series PCB Strain Measuring Instrument Dynamic Force Testing
  •  Veshay Akemond TSK Series PCB Strain Measuring Instrument Dynamic Force Testing
Model No.︰TSK-32-8/16/24C
Brand Name︰Akemond
Country of Origin︰China
Unit Price︰US $ 7860 / unit
Minimum Order︰1 unit
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Product Description

Akemond TSK Series PCB Strain Measurement System

Akemond Strain measurements is a designed for PCB board test and special tailor-made test system, the system provides many more stable hardware and powerful analysis software, and provides a user-friendly interface, to be able to significantly improve your test efficiency and product quality.

1.Compact and light weight

2.Card expansion channel

3.Software filtering function

4.Connect to strain gauge directly

5.Available for 120 and 350 ohms in puts

6.Easily connect to PC via Hi-Speed USB port

7.All channels acquire strain signal simultaneously

8.High speed sampling rate up to 10kHZ per channel

9.User-friendly software with One-touch report generation function

Date record/analysis/report software

Real-time display, Reporting function , Parameters setting, Auto-calculation function (Max/Min strain value ,Peak to Peak strain value, Diagonal strain, Max/Min Principal strain, Strain rate and more)

Strain testing allows objective analysis of the strain and strain rate levels that a SMT package is subjected to during PWB assembly, test and operation.

Standing out from numerous brands, such as Kyowa PCD-400B and EDX series, Memstec Elogger, NBM DAQ System, National Instrument etc., Akemond PCB Strain Measurement System is special design for printed wiring board strain testing application, The real-time data provided by the Veshay system avoid the risk such failures including solder ball cracking, trace damage, pad lifting and substrate cracking during board manufacturing and test processes.

Payment Terms︰TT
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